| FPC Capacity | |
| Layers: | 1-8 layers |
| Board thickness: | 0.05-0.5mm |
| Copper thickness: | 0.5-3OZ |
| Minimum Width: | 0.075mm |
| Minimum space: | 0.075mm |
| In through hole size: | 0.2mm |
| Minimum laser hole size: | 0.075mm |
| Minimum punching hole size: | 0.5mm |
| Soldermask tolerance: | +\-0.5mm |
| Minimum routing dimension tolerance: | +\-0.5mm |
| Surface finish: | HASL,LF HASL, Immersion Silver, Immersion Gold,Flash Gold, OSP |
| Shaping: | Punching, Laser, Cut |
| Equipement: | Universal Tester |
| Flying Probe Open/Short Tester | |
| High power Microscope | |
| Solderability Testing Kit | |
| Peel Strength tester | |
| High Volt Open & Short tester | |
| Cross Section Molding Kit With Polisher |