| Rigid PCB capacity | |
| Material: | FR4\high TG FR4\Lead free material\CEM1\CEM3\Aluminum\Metal core\PTFE\Rogers |
| Number of Layer: | 1-32Layers |
| Out layer Cu thickness: | 1-6OZ |
| Inner layer Cu thickness: | 1-4OZ |
| Maximum processing area: | 610 x 1100 mm |
| Min board Thickness: | 2 Layer - 0.3mm(12mil) |
| 4 Layer - 0.4mm(16mil) | |
| 6 Layer - 0.8mm(32mil) | |
| 8 Layer - 1.0mm(40mil) | |
| 10 Layer - 1.1mm(44mil) | |
| 12 Layer - 1.3mm(52mil) | |
| 14 Layer - 1.5mm(59mil) | |
| 16 Layer - 1.6mm(63mil) |
| Minimum Width: | 0.076mm (3mil) |
| Minimum Space: | 0.076mm (3mil) |
| Minimum hole size (final hole): | 0.2mm |
| Drilling hole size: | 0.2-0.65mm |
| Drilling tolerance: | +\-0.05mm(2mil) |
| PTH tolerance: | Φ0.2-1.6mm +\-0.075mm (3mil) |
| Φ1.6-6.3mm+\-0.1mm(4mil) |
| NPTH tolerance: | Φ0.2-1.6mm +\-0.05mm(2mil) |
| Φ1.6-6.3mm+\-0.05mm(2mil) |
| Finish board tolerance: | Thickness＜0.8mm, Tolerance:+/-0.08mm |
| 0.8mm≤Thickness≤6.5mm,Tolerance+/-10% |
| Minimum soldermask bridge: | 0.076mm (3mil) |
| Twisting and bending: | ≤0.75% Min0.5% |
| Raneg of TG: | 130-215℃ |
| Impedance tolerance: | +/-10%，Min+/-5% |
| Surface Treatment: | HASL, LF HASL |
| Immersion Gold, Flash Gold,Gold finger | |
| Immersion Silver, Immersion Tin,OSP |